Wide Bonding Window and High Reliability Cu bonding wire

Palladium plated copper wire delivers the lower cost than Au bonding wire and greater in manufacturing control than bare copper bonding wire. FAB of TC-ZS-1 is very soft and it is good solution for chip damage or Al splash.

★Soft FAB and Good 2nd Bond ability
-Less chip damage and Al splash
-Better bond ability than conventional bare Cu wire.
★High reliability & Long floor life
-Higher reliability & longer floor life than conventional bare Cu wire.